There has been buzz around the upcoming Meizu Pro 6 flagship smartphone which is said to sport a massive 6GB of RAM. Now, a new report says that Meizu has opted for MediaTek’s all-new Helio X25 chipset for the its Pro 6 flagship.
Gizchina reports that MediaTek at an event in China announced that the new Helio X25 was co-developed with Meizu and will be exclusive to the Pro 6 flagship initially. The exact clock speed has not been revealed but the Helio X25 chipset is likely to be an upgraded version of the Helio X20 deca-core processor.
To recall, MediaTek announced the Helio X20 processor last year and claimed it to be the ‘world’s first mobile processor with tri-cluster CPU architecture’ and featuring 10-cores.
The tri-cluster CPU architecture consists of three processor clusters, with the company claiming that each is designed to more efficiently handle different types of workloads. The MediaTek Helio X20 packs one cluster of two ARM Cortex-A72 cores (clocked at 2.5GHz for extreme performance), and two clusters of four ARM Cortex-A53 cores (one cluster clocked at 2GHz for medium loads, one clocked at 1.4GHz for light activities).
The current report also contradicts an earlier report that said Meizu will use Samsung-made Exynos chips for its Pro 6 flagship.
Based on preliminary leaks, Meizu’s upcoming flagship smartphone is likely to feature 6GB of RAM alongside a large 128GB of inbuilt storage. Rumours point to a second version of the Pro 6 as well featuring 4GB of RAM with 64GB of inbuilt storage.